ERC Consolidator Grant · 2018
3D integration of a logic/memory CUBE for In-Memory-Computing
For integrated circuits to be able to leverage the future “data deluge” coming from the cloud and cyber-physical systems, the historical scaling of Complementary-Metal-Oxide-Semiconductor (CMOS) devices is no longer the corner stone. At system-level, computing performance is now strongly power-limited and the main part of this power budget is consumed by data transfers between logic and memory circuit blocks in widespread Von-Neumann design architectures. An emerging computing paradigm solution overcoming this “memory wall” consists in processing the information in-situ, owing to In-Memory-Computing (IMC). However, today’s existing memory technologies are ineffective to In-Memory compute…
From the public funding record at EU CORDIS. Describes the funded project, not the reviews below.
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